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The Technology

Built for the Next Generation of AI Computing

From Blackwell's FP4 precision to AMD CDNA 3 and Intel Granite Rapids - we deliver the most advanced chip architectures in the industry. Explore the technologies powering next-gen AI.

The Technology

Built for the Next Generation of AI Computing

From Blackwell's FP4 precision to AMD CDNA 3 and Intel AMX - we deliver the most advanced chip architectures in the industry.

SERVCHIP
Interactive view
MEMORY BANDWIDTH
8 TB/s
ARCHITECTURE
Blackwell
  • Multi-Architecture Server Support

    NVIDIA Hopper, AMD CDNA 3/4, Intel Granite Rapids β€” all in one data center platform

  • AI Acceleration

    Tensor Cores, Matrix Extensions, dedicated AI engines across all semiconductor platforms

  • High-Bandwidth Memory

    HBM3, HBM3e, GDDR6 server memory for the most memory-intensive enterprise workloads

  • Advanced Interconnects

    NVLink, Infinity Fabric, UPI, CXL for seamless multi-GPU data center scaling

  • Open Ecosystems

    CUDA, ROCm, oneAPI β€” choose your semiconductor development platform freely

  • Enterprise Reliability

    ECC memory, RAS features, multi-vendor server certification for production deployments

  • Scalable Architecture

    From edge servers to exascale data centers β€” single GPU to GPU clusters of any size

Blackwell & Hopper

Latest architectures powering trillion-parameter AI models

20 PFLOPS
FP4 Performance

Transformer Engine

Hardware acceleration for transformer-based AI models

2.5x
Faster Training

NVLink 5.0

Seamless GPU interconnect for scale-out clusters

1.8 TB/s
Per-GPU Bandwidth

Multi-Instance GPU

Partition a single GPU into isolated instances

7x
Instances per GPU
Architecture Timeline

Four Generations of AI Computing

Each generation delivers a step-change in AI performance - from Ampere's MIG to Blackwell's FP4.

2024

Blackwell

20 PFLOPS FP4

The most powerful GPU ever built. Dual-die design with 10 TB/s interconnect, 384GB HBM3e, and native FP4 precision for trillion-parameter AI.

FP4 Tensor CoresTransformer Engine v2NVLink 5.0 (1.8 TB/s)Dual-die design
Chips:B200GB200
Process Node
4NP TSMC
Gen 1 of 4
2022

Hopper

Transformer Engine

The industry standard for AI training. Introduces the Transformer Engine, 4th-gen Tensor Cores with FP8, and 900 GB/s NVLink 4.0.

Transformer EngineFP8 PrecisionNVLink 4.0 (900 GB/s)Confidential Computing
Process Node
4nm TSMC
Gen 2 of 4
2022

Ada Lovelace

3rd-gen RT Cores

Workstation and consumer GPU architecture. Delivers 2x ray tracing performance and 4th-gen Tensor Cores with FP8 for professional AI workloads.

3rd-gen RT Cores4th-gen Tensor CoresAV1 Encode/DecodeDLSS 3.5
Process Node
5nm TSMC 4N
Gen 3 of 4
2020

Ampere

Multi-Instance GPU

The proven workhorse of enterprise AI. Third-gen Tensor Cores with TF32, MIG partitioning, and structural sparsity for 2x AI performance.

3rd-gen Tensor CoresMIG (7 instances)TF32 PrecisionStructural Sparsity
Process Node
7nm TSMC
Gen 4 of 4
Feature Deep Dives

Inside the Technology Stack

The innovations across NVIDIA, AMD, Intel and more that power AI, HPC, and accelerated computing.

Transformer Engine

Hardware acceleration purpose-built for transformer models. Automatically chooses between FP8 and FP16 per layer to maximize throughput while maintaining accuracy - delivering up to 9x faster AI training on Hopper and beyond.

9x
Faster Training

NVLink & NVSwitch

NVIDIA's high-speed GPU interconnect scales from 600 GB/s on Ampere to 1.8 TB/s on Blackwell. NVSwitch enables all-to-all communication, letting clusters of GPUs act as one giant accelerator for exascale workloads.

1.8 TB/s
Per-GPU Bandwidth

Multi-Instance GPU (MIG)

Partition a single GPU into up to 7 isolated instances with independent memory, cache, and compute. Ideal for cloud providers running multiple tenants on a single A100 or H100.

7x
Instances per GPU

Grace CPU Superchip

72 Arm Neoverse V2 cores connected to Hopper GPU via NVLink-C2C at 900 GB/s. The GH200 superchip offers up to 624GB unified memory for giant AI models that don't fit on traditional GPUs.

624GB
Unified Memory

Confidential Computing

Hardware-level isolation protects data and code in use. H100's confidential computing mode secures AI workloads in multi-tenant clouds and regulated industries.

100%
In-Use Encryption

Omniverse & Digital Twins

Build physically accurate digital twins of factories, cities, and robots. Powered by RTX GPUs and Universal Scene Description, enabling industrial metaverse applications.

RTX
Physically Accurate

Multi-Platform Highlights

Multi-Architecture Server Support

NVIDIA Hopper, AMD CDNA 3/4, Intel Granite Rapids β€” all in one data center platform

AI Acceleration

Tensor Cores, Matrix Extensions, dedicated AI engines across all semiconductor platforms

High-Bandwidth Memory

HBM3, HBM3e, GDDR6 server memory for the most memory-intensive enterprise workloads

Advanced Interconnects

NVLink, Infinity Fabric, UPI, CXL for seamless multi-GPU data center scaling

Open Ecosystems

CUDA, ROCm, oneAPI β€” choose your semiconductor development platform freely

Enterprise Reliability

ECC memory, RAS features, multi-vendor server certification for production deployments

Scalable Architecture

From edge servers to exascale data centers β€” single GPU to GPU clusters of any size

Architecture Comparison

Specs Side-by-Side

Compare modern chip architectures across key metrics.

SpecificationBlackwellHopperAda LovelaceAmpere
ArchitectureBlackwellHopperAda LovelaceAmpere
Process Node4NP TSMC4nm TSMC5nm TSMC 4N7nm TSMC
Max Memory384GB HBM3e141GB HBM3e48GB GDDR680GB HBM2e
Memory Bandwidth8 TB/s4.8 TB/s960 GB/s2 TB/s
FP8 Performance9000 TFLOPS3958 TFLOPS2816 TFLOPS-
FP4 Performance20 PFLOPS---
NVLink5.0 (1.8 TB/s)4.0 (900 GB/s)Optional3.0 (600 GB/s)
Tensor Cores5th gen4th gen4th gen3rd gen
TDP (max)1000W700W350W400W