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SERVCHIPENTERPRISE CHIPS
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Compare Enterprise Chips

Select chips to view a detailed side-by-side specification comparison across all manufacturers

In Stock

H100

Hopper

In Stock

H200

Hopper

Pre-Order

B200

Blackwell

Memory
Memory
80GB HBM3
141GB HBM3e
384GB HBM3e
Memory Bandwidth
3.35 TB/s
4.8 TB/s
10 TB/s
Compute
Tensor Cores
528
528
—
CUDA Cores
18432
18432
—
FP8 TFLOPS
1979
1979
4500
FP16 TFLOPS
989
989
2250
TF32 TFLOPS
494.5
494.5
1125
FP64 TFLOPS
60
60
—
Connectivity
Interconnect
NVLink 4.0, 900GB/s
NVLink 4.0, 900GB/s
NVLink 5.0, 1.8TB/s
Physical
TDP
700W
700W
1000W
Form Factor
SXM5
SXM5
SXM6
Cooling
Liquid Cooled
Liquid Cooled
Liquid Cooled
Launch Date
Q1 2024
Q2 2024
H2 2024
Manufacturing Process
4nm
4nm
4nm
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