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SERVCHIPENTERPRISE CHIPS
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Compare Enterprise Chips

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Pre-Order

B200

Blackwell

In Stock

H200

Hopper

In Stock

H100

Hopper

Memory
Memory
384GB HBM3e
141GB HBM3e
80GB HBM3
Memory Bandwidth
10 TB/s
4.8 TB/s
3.35 TB/s
Compute
Tensor Cores
—
528
528
CUDA Cores
—
18432
18432
FP8 TFLOPS
4500
1979
1979
FP16 TFLOPS
2250
989
989
TF32 TFLOPS
1125
494.5
494.5
FP64 TFLOPS
—
60
60
Connectivity
Interconnect
NVLink 5.0, 1.8TB/s
NVLink 4.0, 900GB/s
NVLink 4.0, 900GB/s
Physical
TDP
1000W
700W
700W
Form Factor
SXM6
SXM5
SXM5
Cooling
Liquid Cooled
Liquid Cooled
Liquid Cooled
Launch Date
H2 2024
Q2 2024
Q1 2024
Manufacturing Process
4nm
4nm
4nm
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