The HPE Cray XD670 brings supercomputing DNA to enterprise AI. Featuring up to 8 double-width GPUs and dual AMD EPYC processors, it is engineered for the most demanding LLM training and HPC workloads. With direct liquid cooling (DLC) readiness and the HPE Cray Slingshot interconnect, the XD670 delivers extreme scalability for AI at scale.
Complete technical specifications for the Cray XD.