Micron HBM3E memory delivers over 1.2 TB/s bandwidth per stack for the most demanding AI and HPC workloads. Available in 8-Hi and 12-Hi configurations, Micron's HBM3E offers the highest bandwidth density for AI accelerators in data centers worldwide.

Key Features

1.2+ TB/s Bandwidth
Up to 36GB Stack
Advanced Node
Low Latency
12-Hi Support

Ideal Use Cases

ai traininghpc

Memory Specifications

Complete technical specifications for the HBM3E.

Type

Type: HBM3E

Capacity

Capacity: 36GB per stack

Performance

Speed: 9.6 Gbps
Bandwidth: 1.2+ TB/s per stack

Physical

Form Factor: 8-Hi / 12-Hi Stack
Voltage: 1.1V

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